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Thermo-mechanical Creep Simulation

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Contacts between dissimilar materials with different coefficient of thermal expansion causes uneven expansion of the components, leading to stress build-ups and creep formation causing cracks on the chip. Chip cracks could lead to component failure. The objective of this study is to evaluate the chip crack formation for the package with two types of soldering methods.

The entire creep simulation was set up to run for 19145 seconds (5.3 hours) and was solved in-house within 2.5 hours.