Contacts between dissimilar materials with different coefficient of thermal expansion causes uneven expansion of the components, leading to stress build-ups and creep formation causing cracks… Read More »Thermo-mechanical Creep Simulation
As part of a thermal fatigue study for a PCB assembly, a conjugate heat transfer CFD analysis using Solidworks Flow Simulation was carried out to… Read More »PCBA Conjugate Heat Transfer Analysis
29 March 2019 – To identify the maximum principal stresses at the interfaces between the components of the package subjected to two temperature extremes. This… Read More »Structural Analysis of LED Package
11 June 2019 – A thermal structural FEA analysis was carried out on an optocoupler package to assess the behavior and principle stresses of the… Read More »Thermal Structural FEA Analysis for Optocoupler package